New laptop ditches noisy fans and heat sinks for tiny 'cooling chips' — it's much thinner and lighter than you'd expect

BERLIN — Lenovo has unveiled a concept laptop that uses high-speed air to silently cool its processor, instead of conventional fans or heat sinks. The new system is powered by a tiny computer chip that can fit between your fingers.

The new laptop, called AeroBlade, is fitted with four low-power cooling chips that are both "solid-state," meaning there are no moving parts, and "active" — they use a deliberate cooling mechanism — as opposed to relying on passive thermal energy transfer.

The cooling chips contain tiny membranes that vibrate at ultrasonic frequencies to create 2,000 pascals of back pressure, forcing ambient air through tiny internal jets onto a copper base layer at speeds of around 124 miles per hour (200 kilometers per hour). This air carries heat away from the laptop's central processing unit (CPU) and graphics processing units (GPU), before being violently expelled from tiny vents at its rear hinge.

Lenovo representatives unveiled their new AeroBlade machine at Lenovo Innovation World '26, which took place Sept. 3 at IFA 2026 in Berlin, which itself ran between Sept. 4 and 8.

Made by engineers at Frore Systems, the low-power AirJet Mini chip measures 1.63 x 1.06 x 0.1 inches (41.5 x 27 x 2.65 mm) and weighs just 0.02 pounds (9 grams). Because it contains tech designed to replace conventional cooling technologies, the AeroBlade, which is fitted with a 14-inch (355.6 mm) OLED display, is much thinner and lighter than comparable laptops

The AeroBlade measures less than 0.39 inches (10 mm) thick — where comparably sized machines measure 0.51 inches (12 mm) at their thinnest — and weighs just 1.8 pounds (830 g). Laptops as light as this exist, like the 1.76-pound (799 g) Acer Swift Blade 14, but they're rare. Counterparts with 14-inch screens are normally considered light if they fall between 2.2 to 2.86 pounds (1 to 1.3 kilograms).

Both companies are framing the introduction of this technology as a way to cool down the next generation of high-end laptops that will wield on-device artificial intelligence (AI).

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